Text / "High-tech LED" reporter Hu Yanling
With the gradual increase in the penetration rate of the LED lighting market, high-power integrated chips will also become the mainstream of future LED applications.
Jingke Electronics (Guangzhou) Co., Ltd. is a joint venture company of Hong Kong Microcrystalline Advanced Optoelectronics Technology Co., Ltd. Since its establishment, it has been focusing on high-power chips. The monthly production capacity is above 10KK. Last year, the company's output value reached 100 million yuan.
“Jingke Electronics has always relied on technological innovation and core continuous research and development capabilities to enhance market competitiveness.†Dr. Xiao Guowei, Managing Director of Jingke Electronics, said in an interview with Gaogong LED, “As a few in China, it has scale. The company develops and manufactures high-power, high-brightness LED chips. The market of Jingke Electronics is positioned in the middle and high-end, and more than 70% of its products are used in the field of lighting. The company has been committed to building a leading brand of high-brightness LED integrated chips.
Pictured: Dr. Xiao Guowei, Managing Director, Jingke Electronics
High power and integration is the development trend of LED chips Since its establishment, Jingke has positioned itself as a high-brightness LED, integrated chip and module light source, and has independently developed a high-power product with flip-chip bonding and integrated chip as its core technology. In 2010, Jingke introduced a strategic investment to build an LED industry base in Nansha, Guangzhou. It is expected that the first phase of the project will be completed in August this year, and the annual output value of 100-1.5 billion yuan can be realized after the project is put into production.
With general lighting requirements for LED light source design and multi-function use, the demand for modular light source and lamp system function light source is rapidly increasing, and the improvement of luminous efficiency and device cost are also urgent problems in the industry.
According to reports, although the low power has a price advantage, the light decay is serious. In addition, when low-power LED chip package is used, the material usually packaged with transparent epoxy resin has poor high-temperature characteristics, and the glass point temperature is only 125 degrees. In a high temperature environment, the long-term use transmittance will be deteriorated. , affect the photoelectric performance of the device. The protection of high-power LED chips usually uses transparent silica gel with better high-temperature performance than epoxy resin. With the development of high thermal conductivity materials, the heat dissipation problem of high-power LED chip package will be solved. Therefore, the low-power chip will be suitable for fluorescent tubes and indicator products with high requirements for uniform illumination, and high-power chips will be widely used for illumination.
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