This type of Cable Tray is made through domestic and abroad experience and is improved from the making experience of similar products in our factory.It has many advantages,light weight,low cost,unique type,easy installation,good heat dissipation and ventilation.This type generally applies to large diameter cables laying, especially suitable for high and low voltage power cable laying.
Three types of treatment to surface,electrostatic spray,galvanization,painting.In high corrosive circumstances,special anti-corrosive process is available.
Ladder Type Fiberglass Cable Tray Heavy Duty Cable Tray,Fiberglass Ladder Cable Tray,Heavy Duty Fiberglass Cable Tray,Ladder Type Fiberglass Cable Tray Jiangsu Loncin Electric Equipment Co.,Ltd , https://www.loncincabletray.com
On the 13th, UMC-US (UMC-US) and IBM (IBM-US) jointly announced that UMC will join the IBM Technology Development Alliance to jointly develop 10nm CMOS process technology.
The agreement between UMC and IBM has expanded the 14-nanometer FinFET cooperation agreement signed by both parties in 2012. With IBM's support and know-how, UMC will continue to enhance its own internally developed 14nm FinFET technology and provide competitive, low-power optimization technology for mobile computing and communications products.
Both parties plan to develop 10nm process technology to meet the needs of UMC's customers. UMC will assign an engineering team to the 10-nanometer R&D project in Albany, New York. UMC's 14-nanometer FinFET and 10-nanometer future manufacturing will be carried out by R&D center of Taiwan Nanke.
Gary Patton, vice president of R&D at IBM Semiconductor, said that the IBM alliance has been established for more than 10 years. The alliance partners can integrate IBM's expertise and team research cooperation and innovative technology research and development to meet the growing demand for advanced semiconductor applications. The joining of UMC will make the alliance more powerful.
UMC CEO Yan Bowen said that IBM is recognized as a leader in semiconductor technology. UMC is very pleased to cooperate with IBM in advanced process areas and contribute to the company’s accumulated experience in the development of highly competitive manufacturing technologies over the years. As one of the world's leading wafer fabs, UMC is committed to launching cutting-edge manufacturing processes at the right time to realize the mission and promise of the next-generation wafer design for customers. The company is looking forward to working closely with IBM and focusing on its deep technical expertise to shorten the development cycle of 10nm and FinFET and create a win-win situation for UMC and its customers.
Protectors for fiberglass Ladder Type Cable Tray are prepared.You can mark your needs when you give orders or simply purchase according to the size of protector.All accessories can be used in cable tray and ladder type cable tray.
