DIALOG Semiconductor Co., Ltd. launches the world's smallest Bluetooth® smart chip

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Beijing, China, May 21, 2013 – Dialog Semiconductor, Inc. (AMSE: DLG), a provider of integrated power management, audio and short-range wireless technologies, today introduced the world's lowest power and smallest SmartBondTM (part number) :DA14580) Bluetooth? Intelligent System-on-Chip (SoC). Compared to competing solutions, this product doubles the battery cruising time of smartphone accessories with applications or computer peripherals. The chip is designed to wirelessly connect a keyboard, mouse or remote control to a tablet, laptop or smart TV; enabling consumers to use their innovative applications on smartphones and tablets with watches, Bracers or smart labels establish connections to achieve "self-monitoring" of health and physical conditions, looking for lost keys and other functions.

SmartBond is the first Bluetooth smart solution to break the 4mA wireless transceiver current limit, allowing designers to double the battery life of their products or reduce the number and size of batteries required. Its unique low-power architecture consumes only 3.8 mA of wireless transmit and receive current, 50% lower than other Bluetooth smart solutions on the market, and its deep sleep mode current is less than 600 nA. This means that in a product that sends 20 bytes per second, a 225mAh coin cell battery can keep it running for 4 years and 5 months; compared to previous generations of Bluetooth smart technology can only last 2 years. .

The DA14580 has a power management block with a DC-DC converter and all necessary LDOs, reducing the need for external components and total bill of materials. By precisely turning the power to each chip on and off, Dialog can minimize power consumption. The operating voltage of SmartBond has been reduced to 0.9V, which was previously impossible, so that an alkaline or nickel-manganese battery can be used to run a computer or smart TV peripheral, which was previously required. This opens the door to numerous new design ideas for designers, enabling them to develop ultra-compact and new-sized products while reducing the total cost of the system. Energy harvesting technologies, such as collected light or kinetic energy, can also be used to charge rechargeable batteries that support system operation.

In addition, the DA14580 has the advantage of size. Available in three sizes, the smallest wafer-level chip size package (WL-CSP) is only 2.5 X 2.5 X 0.5 mm. This ultra-small size allows designers to use Bluetooth technology in the most space-constrained wireless accessories.

The DA14580 includes a 32-bit ARM® CortexTM M0 core and a one-time programmable (OTP) on-chip flash memory that provides extreme design flexibility, eliminates the need for an external processor and reduces cost. Dialog has begun working with Murata, the world's leading wireless module manufacturer, to develop small modules that allow original designers with relatively little knowledge of RF systems to quickly integrate certified solutions into their products.

Mr. Shinichi Kawanishi, Product Manager, Connection Modules, Murata Manufacturing Co., Ltd. said: "With our partnership with Dialog Semiconductors and their highly competitive DA14580, we look forward to releasing a range of lower power and more compact The low-power Bluetooth module has made a difference in driving this high-growth market."

Sean McGrath, vice president and general manager of the Connect, Automotive and Industrial Business Group at Dialog Semiconductor, said: "With the launch of SmartBond, Dialog continues to drive diversification of its product offerings. Dialog uses its smartphones, tablets, and home wireless sensors. Expertise in low-power management of the network market, developed this Bluetooth intelligent system-on-chip, and broke the record in terms of power consumption and chip size. Currently, we are working with some front-line customers in the field of accessories and peripherals. ""

The use of Bluetooth smart chips is rapidly increasing. According to IHS Inc. (NYSE:HIS), by the end of 2016, the planned shipments of Bluetooth Smart ICs will exceed 350 million.

Lisa Arrowsmith, deputy director of HIS Connectivity Research, said: "Bluetooth smart chips are rapidly gaining popularity in fitness and medical devices, and are moving away from proprietary technologies. In addition, with compatible Bluetooth smart standards in TVs, tablets, and notebooks Increasingly popular in consumer electronics such as computers and all-in-ones, these devices are likely to be used to build energy-efficient wireless connections in high-capacity devices such as remote controls and PC peripherals, or to implement a range of new applications."

The Dialog DA14580 currently only provides samples for a small number of customers and plans to begin volume production in the fourth quarter of 2013.

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