Is the CSP technology barrier difficult to break through? This WLCSP light source says "NO"!

I talked about CSP for a long time and grew up in the industry debate. As everyone knows, when CSP first appeared, it shocked four people to replace the original LED package. This has once become a topic of debate in the major forums of the industry.

After years of development, everyone is no longer in a strange state of CSP technology, and many chip and packaging companies have made a lot of efforts. However, to this day, due to the existence of many difficult technical problems, the development of CSP technology is still somewhat unsatisfactory, and has not achieved widespread popularity. The industry generally believes that the CSP market is still in the development stage, and its large-scale application will face greater challenges.

According to Dr. Sun Zhijiang, Chairman of Heidico (Nantong) Optoelectronics Technology Co., Ltd. (hereinafter referred to as “Heidi”), CSP light source technology currently faces four major challenges:

First of all, CSP is not easy to mount, and it is difficult to solder on the upper plate. Dr. Sun Zhijiang said that since the positive and negative electrode spacing of the chip is only 90-200 microns, the chip and solder paste need to be very accurately aligned, otherwise it is easy to leak. In addition, the traditional CSP phosphor is opaque, whether the chip is arranged neatly in the package body, whether the offset is unknown, this will increase the difficulty of placement; secondly, the width of the CSP side colloid is generally uneven, resulting in uneven light color, part The product may even produce yellow edge phenomenon; again, because the phosphor distribution uniformity, width, and side luminescence are difficult to control, the Bin rate is low after one coating; finally, the phosphor layer is thicker, resulting in poor airtightness and heat dissipation. .

Four major technical problems lie in the gap, so CSP applications face two limitations: First, small-size chip CSP placement is more difficult, the current CSP application is mainly limited to more than 1W applications; second, the cost is high, leading to its high optical density High-brightness, high directivity applications that take full advantage of CSP features, including headlights, flashlights, backlights, and high-end color-adjustable lighting applications, are difficult to extend to other areas.

In response to the CSP technical difficulties, after completing the hard work of the technical team, Heidico successfully developed and launched a new type of light source WLCSP, thus achieving a substantial upgrade of CSP technology.

What is WLCSP? Dr. Sun Zhijiang explained: “WLCSP extends the packaging process and chip process further to the upstream chip process, packaging on a wafer scale to form an opaque core, and a semi-transparent phosphor that surrounds the outside.” Dr. Sun Zhijiang believes that The link between the industrial chains is the most prone to technological innovation.

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Dr. Sun Zhijiang introduced to Gaogong LED that WLCSP effectively solved the above problems faced by CSP. First, the WLCSP facilitates placement, which not only allows for more precise control of the position between the light source and the substrate, but also allows for the installation of two different CSP sources within a millimeter range of the tintable temperature filament lamp; The phosphor layer is turned from thick to thin. Generally, at high optical density, the heat source of the light source is not only the LED chip that is traditionally concerned, but also the phosphor generates a large amount of heat while down-converting to emit yellow-green light, so it is necessary to perform good heat dissipation when the phosphor colloid is thick. The heat will be blocked. "For general products, when the power reaches 4w or more, the surface temperature will reach 150 degrees or more, the light efficiency will be reduced, and the colloid will be cracked. In the same case, the surface temperature of WLCSP is only 110--120 degrees, which increases the height. "Reliability"; third, further increase the phosphor into the bin rate; fourth, the light color is more uniform, effectively preventing side leakage blue and yellow edges caused by uneven phosphor distribution; finally, the light angle can be arbitrarily adjusted, Adapt to different application needs.

"Small can be smaller, bigger can be bigger." Dr. Sun Zhijiang concluded. He said that WLCSP products fulfilled the company's "full application, full size" commitment to customers, enabling CSP applications to successfully break through the limitations of special lighting and enter the field of general lighting.

When asked why the WLCSP light source was developed, Dr. Sun Zhijiang simply replied: "I hope that CSP can really reach the middle and high-end lighting field." He said that Heidico will continue to maintain this initial intention. Efforts to develop and make CSP technology develop "all the way."

Why did Heidico, which was established in 2012, overcome industry problems in just over five years? Gaogong LED has learned that Heidico has gathered a group of domestic and foreign professionals who have been engaged in semiconductor for many years and has strong research and development capabilities. His founder, Dr. Sun Zhijiang, is an expert in the National “Thousand Talents Program”. He was a Ph.D. in Materials Science at Texas State University. During his time at Intel R&D, he led the SRAM memory for 90nm R&D. The NPT (New Product Tapeout) new product introduction team solved the initial zero yield problem at 90 nm and won the Intel Contribution Award.

In the past few years, Heidico has been thinking about R&D in constant practice, and carefully screened which frameworks of integrated circuits can be applied to the LED industry to extract its essence. "We have only used some of these useful concepts, but in essence LED is a discrete optoelectronic device, the most important thing is to adapt to the needs of customers." Sun Zhijiang added, "LED products should be personalized."

Through intensive cultivation in the upstream chip field, the research results that have filled the domestic blanks have been born frequently in the past few years. Heidico has obtained 16 invention patents, and the 20 patents currently applied have entered the approval process, and the product effect is far beyond its own. expected.

Next, Heidel will take advantage of the WLCSP's adjustable light angle to get involved in full spectrum applications. "Our C-series products can achieve full spectrum, and we will carry out research and development of the full-spectrum health series in the future." Sun Zhijiang finally revealed. From his confident and keen eye, we believe that Heidelco's WLCSP light source will be able to break through the limitations of traditional LED light sources, providing a more powerful core light source for high optical density and high directivity lamps, and solving some of the downstream applications. The pain point further promotes the development of China's high optical density and high-point LED lighting industry.

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